This is a set of automatic high-frequency blister packaging welding equipment independently developed by our company. The process flow of this equipment is as follows:
1.At the 1st station, the blister manipulator for the bottom cover places it into the turntable mold;
2.At the 2nd station, the packaged items are placed manually (or by a manipulator);
3.At the 3rd station, the manipulator automatically places the paper card into the mold;
4.At the 4th station, the blister manipulator for the upper blister places it into the turntable mold;
5.At the 5th station, high-frequency technology is used for automatic welding and cutting;
6.At the 6th station, the manipulator automatically takes down the welded products and waste materials from the turntable and places them into turnover boxes. (If the finished products and waste materials need to be separated and not placed in the same turnover box, an assembly line can be additionally installed: after being taken out, the products are placed on the assembly line and then transferred into product boxes, while the waste materials are directly put into waste bins by the manipulator). Through the above steps, a complete process is completed.
Operators continuously place product raw materials in accordance with the turntable cycle, and the high-frequency operation cycle enables efficient automatic completion of the welding process. Users can freely set the operation cycle, which is generally 6-12 seconds per cycle.